So confirmed no need delid for AMD R7.

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Result is no big different with HIS originally , AMD this time doing well.
samhcl 發表於 2017-3-9 11:48



    AMD年年蝕錢都堅持solder散熱,確實夠有良心了...

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回覆 4# macis

點會?可能啲人睇到個數唔啱,點搞都搞唔好,最後開蓋分析,換完再試。

我睇到後,嘗試從客觀睇成單野,原來係導熱唔夠快。 

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回覆 12# chanfc2015

應該係吸客手法。因為仲有好多客都未知電腦係咩野。 

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其實將CPU開蓋真係好多餘,第一開蓋後,冇左保養,第二容易壓壞晶片,又要超頻,又怕熱,又唔願意花錢降溫,ㄧ支針邊有兩頭都尖的

via HKEPC Reader for Android

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其實將CPU開蓋真係好多餘,第一開蓋後,冇左保養,第二容易壓壞晶片,又要超頻,又怕熱,又唔願意花錢降溫,ㄧ支針 ...
kelvinwy 發表於 2017-3-10 11:33


many people delid Intel cpu will put IHS back. They just change the cheap thermal paste into liqual metal inside only, Think not too many people use direct die attach cooling I think.

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本帖最後由 s84292 於 2017-3-10 11:56 編輯
其實將CPU開蓋真係好多餘,第一開蓋後,冇左保養,第二容易壓壞晶片,又要超頻,又怕熱,又唔願意花錢降溫,ㄧ支針 ...
kelvinwy 發表於 2017-3-10 11:33


非錫焊,例如7700K 唔開蓋,你個冷頭貴到飛起都冇用,因為根本散唔到出黎
可以自己搵下REVIEW, 開蓋平均降18-30度

但係鍚焊CPU開蓋就真係多鬼餘,6950X有人成功開,低得1度

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Ryzen 蓋下唔係話有 sensor, 開左會整爛架咩

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